Development of electroless plating process for the power.

Bath and Deposit Monitoring System for Electroless Nickel Plating Process

Electroless nickel plating is a widely used plating method in many industries. The usability of the coating is, however, restricted by the control problems related to the electroless nickel plating process. To ensure deposit quality, the transcendent properties of electroless nickel deposit should be accurately controlled during plating, which is challenging because of the spontaneous, unstable...

Ultrasound-Assisted Pd Activation Process for Electroless Silver Plating

An ultrasound-assisted activation method for electroless silver plating is presented in this study. When the ultrasound was applied during the activation step, the amount of the Pd species adsorbed on substrate surfaces was higher than that of sample pretreated with a conventional activation process without ultrasound irradiation. With this activation method, it was also shown that the adsorbed...

Electroless Nickel Plating: Pcb Process Modelling and Estimation

Development of a Selective Substrate Metallization Process via Electroless Gel Plating

Advanced hybrid microelectronics require high performance packaging materials and components. Alumina, the most widely used ceramic material in microelectronics, is being replaced by new high performance materials such as aluminum nitride (AlN) and beryllia (BeO). AlN's thermal conductivity is an order of magnitude greater than alumina and it has a thermal expansion coefficient very close to si...

Electroless Nickel Plating with Hypophosphite

In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...